Modern electronics have found uses in almost every aspect of our lives, including computing, communication, automation, energy and environment. To a large extent, these advances are the benefits from continuous “scaling-down” of Silicon-based devices. The approach to the ultimate scaling down limits has inspired a worldwide effort to develop alternative device technologies. This proposal addresses the discrepancy between devices’ cut-off frequency, power dissipation and integration level. The solution to the problem can be best achieved by developing novel substrate materials with high carrier mobility and high thermal conductivity. To this end, graphene is a perfect material since graphene exhibits the highest thermal conductivity among all the materials known to the scientific community and the electron mobility in graphene is 100 times faster than that in silicon!